首页> 外文会议>International Conference on Shock amp; Impact Loads on Structures; 20071017-19; Beijing(CN) >DROP IMPACT OF A TYPICAL PORTABLE ELECTRONIC DEVICE- EXPERIMENTS AND MODELING
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DROP IMPACT OF A TYPICAL PORTABLE ELECTRONIC DEVICE- EXPERIMENTS AND MODELING

机译:典型便携式电子设备的跌落冲击-实验和建模

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Drop/impact forces may cause severe functional damage to portable electronic products. This paper presents our investigation on the dynamic behaviour of typical portable electronic devices under drop impact loading. First, an idealized system which contained an outer case and a PCB with an attached packaged chip was adopted as specimen. The actual impact force pulses were measured by employing a Hopkinson bar in a dynamic test rig. Dynamic strains at several locations of the PCB were simultaneously recorded to explore the correlation between the dynamic strains and the impact force pulse. Particular attention was paid to the dependence of the dynamic response of the PCB on the impact velocity,the force pulse, as well as the impact orientation. A simplified analytical model is proposed to interpret the experimental results.
机译:跌落/撞击力可能会对便携式电子产品造成严重的功能损坏。本文介绍了我们对典型便携式电子设备在跌落冲击载荷下的动态行为的研究。首先,采用一个理想的系统作为样本,该系统包含一个外壳和一个PCB,该PCB上装有封装的芯片。实际的冲击力脉冲是通过在动态试验台上使用霍普金森棒来测量的。同时记录了PCB多个位置的动态应变,以探索动态应变与冲击力脉冲之间的相关性。特别注意PCB的动态响应对冲击速度,力脉冲以及冲击方向的依赖性。提出了一种简化的分析模型来解释实验结果。

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