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EFFECT OF THE W-W CONTIGUITY ON CONDUCTIVITY OF W-Cu COMPOSITE

机译:钨连续性对钨铜复合材料电导率的影响

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摘要

W-15wt.% Cu nanocomposite powder fabricated by ball-milling and subsequent hydrogen-reduction was sintered for 1 h at 1200℃ with 5 and 20℃/min. The homogeneity of the sintered microstructures was evaluated by the standard deviation of Vicker's hardness test and thermal conductivity from thermal diffusivity of laser flash method. The W—W contiguity was calculated by using Voronoi diagrams. The sintered microstructure in case of the 20 ℃/min sample was more homogeneous and had lower W-W contiguity than the 5 ℃/min sample. Thermal conductivity of the 20 ℃/min sample was about 5 % higher than the thermal conductivity of the 5 ℃/min sample. As the W-W contiguity was increased, conductivity was decreased. This indicates that the thermal conductivity is affected by the W-W contiguity resulting from the homogeneity of the sintered microstructure.
机译:通过球磨和随后的还原氢工艺制备的W-15wt。%Cu纳米复合粉末在1200℃下以5和20℃/ min的速度烧结1 h。通过维氏硬度试验和热导率与激光闪光法热扩散率的标准偏差来评估烧结组织的均匀性。通过使用Voronoi图来计算W-W连续性。与5℃/ min样品相比,在20℃/ min样品的情况下,烧结后的显微组织更为均匀,W-W连续性较低。 20℃/ min样品的热导率比5℃/ min样品的热导率高约5%。随着W-W连续性增加,电导率降低。这表明热导率受由烧结微结构的均匀性导致的W-W连续性的影响。

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