3D-MCM MINIATURIZED SPACECRAFT PLATFORM MODULES

摘要

The introduction of micromachinery and small-scale processing enables a new level of integration in satellite systems, where the complete chain, from individual dies to system level is miniaturized. Angstrom Aerospace Corporation has been developing this concept, starting on the component packaging level, aiming for a step-by-step introduction of a whole new standardized and modular satellite system, the Microlink concept. Three modules are under development, a general interface module (CSIM), a compact mass memory module (MM) and a magnetotorquer control module (M-ACS). The high packing density is achieved by creating multi-chip-modules, based on silicon substrates, MCM-S. By using silicon as carrier material, many advantages are obtained including the reduction of thermal stresses between the silicon based die and the packaging surrounding it. The mass of the systems decrease remarkable, and further increase in functionality at this miniaturization level does not increase mass, only system complexity. The mass of the modules are estimated to be less then 100 grams, including a load-carrying frame structure. Reducing the mass of systems with one to two magnitudes can improve existing mission concepts, but also enable new types of missions, only viable with a low mass high performance spacecraft.