High Temperature Electronics for Intelligent Harsh Environment Sensors

摘要

1.Future work: 1.1Continuation of high temperature testing 1.2 Continued improvement of fabrication procedures 1.3Fabrication of improved devices based on knowledge gained. 2.Long term goals: 2.1Technology transfer for SiC electronics work 2.2Complete integration of electronics and sensors for total harsh environment sensing capability 2.3Continue to push the envelope of what is possible in high temperature electronics and sensors, e.g., smart wireless sensor systems.