首页> 外文会议>International Electron Devices Meeting >First demonstration of field-free SOT-MRAM with 0.35 ns write speed and 70 thermal stability under 400°C thermal tolerance by canted SOT structure and its advanced patterning/SOT channel technology
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First demonstration of field-free SOT-MRAM with 0.35 ns write speed and 70 thermal stability under 400°C thermal tolerance by canted SOT structure and its advanced patterning/SOT channel technology

机译:通过倾斜的SOT结构及其先进的图案化/ SOT通道技术,首次演示了无磁场SOT-MRAM,其写入速度为0.35 ns,在400°C的热容差下具有70的热稳定性。

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For the first time, we demonstrated 55 nm-CMOS/ spin-orbit-torque-device hybrid magnetic random-access memory (SOT-MRAM) cell with magnetic field free writing. For field free writing, we developed canted SOT device under 300 mm BEOL process full compatible with 400°C thermal tolerance. Moreover, we developed its advanced process as follows; SOT channel layer PVD process for high spin Hall angle under 400°C thermal tolerance, low damage RIE technology of MTJ for high TMR/thermal stability factor (Δ) and ultra-smooth surface metal via process under SOT channel to reduce contact resistance.By above developed technologies, our canted SOT devices fabricated under a 400°C thermal tolerance successfully achieved fast write speed of 0.35 ns without an external magnetic field, a large enough Δ of 70 for non-volatile memory (retention time is over 10 years), and a high TMR ratio of 167%, for the first time. Moreover, we successfully demonstrated field free SOT-MRAM performance.
机译:我们首次展示了具有无磁场写入功能的55 nm-CMOS /自旋轨道扭矩设备混合磁随机存取存储器(SOT-MRAM)单元。为了实现现场自由书写,我们开发了300 mm BEOL工艺下的倾斜SOT器件,完全兼容400°C的耐热性。此外,我们还开发了以下高级流程: SOT通道层PVD工艺可在400°C的高温下实现高自旋霍尔角,具有低损伤的MTJ RIE技术可实现高TMR /热稳定性因子(Δ),并且通过在SOT通道下进行超光滑表面金属通孔处理来降低接触电阻。通过上述先进技术,我们在400°C热容差条件下制造的倾斜式SOT器件在没有外部磁场的情况下成功实现了0.35 ns的快速写入速度,足以用于非易失性存储器的Δ为70(保留时间超过10年),以及TMR比率首次达到167%的高水平。此外,我们成功地展示了免费的SOT-MRAM性能。

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