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Investigation of Void Linkage in Magnesium Using SEM and Micro Computed X-ray Tomography

机译:SEM和微计算机X射线断层扫描技术研究镁中的空洞链接

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Ductile fracture in metallic materials occurs by the nucleation,growth,and linkage of microvoids within the bulk of the material.As a result,two dimensional techniques must be complimented with three dimensional techniques in order to completely characterize the fracture process.In the present study,tensile testing coupled with: scanning electron microscope (SEM) imaging,electron backscattered diffraction (EBSD) patterning,and micro computed x-ray tomography (XCT),have been used to analyze void linkage in magnesium,which exhibits poor formability at room temperature.SEM imaging and EBSD patterning have been used to characterize the mechanisms responsible for void linkage and to determine the effects of void fraction and void orientation on the failure strain.Micro XCT has been used to examine the evolution of internal voids.It has been established that void fraction and void orientation have a weak influence on the failure strain due to the premature linkage of voids.EBSD analysis has shown that this premature void linkage is associated with the failure of twin and grain boundaries.The results suggest that (in contrast with more ductile fcc metals)the local microstructure has a significant impact on void linkage.
机译:金属材料中的延性断裂是由于材料内部的微孔的形核,生长和键合而发生的。因此,必须将二维技术与三维技术相辅相成,才能完整地表征断裂过程。 ,拉伸测试以及:扫描电子显微镜(SEM)成像,电子背散射衍射(EBSD)图案化和微计算机X射线断层扫描(XCT)等技术已用于分析镁中的空隙键,在室温下成型性较差SEM成像和EBSD图案化用于表征造成空隙连接的机制,并确定空隙率和空隙取向对破坏应变的影响.Micro XCT已用于检查内部空隙的演变。由于空隙的过早连接,空隙率和空隙取向对破坏应变的影响很小。结果表明(与更易延展的fcc金属相反),局部微观结构对空隙连接有重大影响。

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