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Notice of Removal: Untangling the mysteries of plated metal finger adhesion: Understanding the contributions from plating rate, chemistry, grid geometry and sintering

机译：移除通知：揭开电镀金属手指粘附的奥秘：了解电镀速度，化学成分，网格几何形状和烧结的影响

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《IEEE Photovoltaic Specialist Conference》|2017年|1-8|共8页
会议地点 Washington(US)
作者
Xi Wang; Pei-Chieh Hsiao; Wei Zhang; Ben Johnston; Alex Stokes; Qilong Wei; Andreas Fell; Sachin Surve; Yuan Shengzhao; Pierre Verlinden; Alison Lennon;
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School of Photovoltaics and Renewable Energy Engineering UNSW NSW Australia 2052;

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1. Untangling the Mysteries of Plated Metal Finger Adhesion: Understanding the Contributions From Plating Rate, Chemistry, Grid Geometry, and Sintering [J] . Xi Wang, Pei-Chieh Hsiao, Wei Zhang, Photovoltaics, IEEE Journal of . 2016,第5期

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2. On characterizing microscopically the adhesion interphase for the adhesion between metal and rubber compound Part III. Effect of brass-plating amount for brass-plated steel cord [J] . Jeon Gyung Soo Journal of Adhesion Science and Technology: The International Journal of Theoredtical and Basic Aspects of Adhesion Science and Its Applications in All Areas of Technology . 2017,第21a24期

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3. Pathway to low-cost metallization of silicon solar cell through understanding of the silicon metal interface and plating chemistry [J] . Abasifreke Ebong Electrochimica Acta . 2014,第Null期

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4. Untangling the Mysteries of Plated Metal Finger Adhesion: Understanding the Contributions from Plating Rate, Chemistry, Grid Geometry and Sintering [C] . Xi Wang, Pei-Chieh Hsiao, Wei Zhang, IEEE Photovoltaic Specialist Conference . 2017

机译：解开镀金属手指粘附的奥秘：了解电镀率，化学，网格几何和烧结的贡献
5. Speciation of technetium-99 incorporated into metal oxide matrices: A molecular level understanding of technetium-99 reduction and its complexation into polyoxometalates and Innovation and assessment of general chemistry education in a college setting. [D] . McGregor, Donna. 2009

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7. Post-plating Annealing of Light Induced Plated Copper Fingers: Implications for Reliable Metallization [O] . Song, N, Hsiao, PC, Zhang, W, 2016

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Notice of Removal: Untangling the mysteries of plated metal finger adhesion: Understanding the contributions from plating rate, chemistry, grid geometry and sintering

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