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Cold Electronics System Development for ProtoDUNE-SP and SBND LAr TPC

机译:ProtoDUNE-SP和SBND LAr TPC的冷电子系统开发

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ProtoDUNE-SP and SBND are both liquid argon (LAr) TPCs for neutrino experiments, they share many common development of cold electronics system. Cold electronics decouples the electrode and cryostat design from the readout design. With front-end (FE) electronics integrated with detector electrodes, the noise is independent of the fiducial volume (signal cable lengths), and much lower than with warm electronics. ProtoDUNE-SP cold electronics mainly consists of 960 FE ASICs, 960 ADC ASICs and 120 cold FPGAs to form 120 Front End Mother Board (FEMB) assemblies. Each FEMB assembly is made up of an analog mother board (AM) and an FPGA mezzanine (FM). An AM has 128 channels with 8 FE ASICs and 8 ADC ASICs designed by BNL for 77K-300K operation and long lifetime with low power consumption. The FM multiplexes and transmits 128 channels of data through four 1 Gb/s serial links to the warm interface electronics. SBND cold electronics mainly consists of 120 FEMB assemblies. The SBND design is exploring two different options, the dual gain ADC option and the commercial ADC option. Market survey and cold screening tests for the op-amp and commercial ADC have been performed to evaluate the feasibility of two options, with focus on the commercial ADC lifetime study currently. An integration test stand with 40% APA (Anode Plane Assembly) has been built at BNL, following the DUNE isolation and grounding rules, to characterize the performance of cold electronics system. The ProtoDUNE-SP installation at CERN is going well, 20 FEMB assemblies have been installed on the first APA successfully, to prepare for the data taking in 2018. SBND front-end readout electronics design will be finalized in 2018, to get ready for the data taking in 2020.
机译:ProtoDUNE-SP和SBND都是用于中微子实验的液氩(LAr)TPC,它们在冷电子系统方面有着许多共同的发展。冷电子设备使电极和低温恒温器设计与读数设计脱钩。使用集成了检测器电极的前端(FE)电子设备,噪声与基准体积(信号电缆长度)无关,并且比温暖的电子设备低得多。 ProtoDUNE-SP冷电子产品主要由960个FE ASIC,960个ADC ASIC和120个冷FPGA组成,形成120个前端母板(FEMB)组件。每个FEMB组件均由一个模拟母板(AM)和一个FPGA夹层(FM)组成。一个AM具有128个通道,其中包含8个FE ASIC和8个ADC ASIC(由BNL设计),可实现77K-300K的操作,使用寿命长且功耗低。 FM多路复用,并通过四个1 Gb / s串行链路将128个数据通道传输到热接口电子设备。 SBND冷电子设备主要由120个FEMB组件组成。 SBND设计正在探索两个不同的选项,即双增益ADC选项和商用ADC选项。已经对运放和商用ADC进行了市场调查和冷筛测试,以评估这两种选择的可行性,重点是目前对商用ADC寿命的研究。 BNL已按照DUNE隔离和接地规则,建立了带有40%APA(阳极平面组件)的集成测试台,以表征冷电子系统的性能。 CERN的ProtoDUNE-SP安装进展顺利,第一个APA已成功安装了20个FEMB组件,以准备2018年的数据采集。SBND前端读出电子设计将在2018年完成,以便为2020年的数据。

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