Additively Manufactured Vertically Interconnected On-Package Microstrip Patch Antenna

摘要

A 17 GHz additively manufactured package integrated patch antenna is presented for vertical interconnection with a MMIC device. The antenna is fabricated using a multi-layer and multi-material 3D-printing process that combines fused deposition modeling of ABS plastic, micro-dispensing of silver paste Du-Pont CB028 and laser machining. Performance is successfully measured and characterized achieving a return loss greater than 19 dB at the desired design frequency, with a 10 dB bandwidth ranging from 16.8 GHz up to 17.4 GHz. Good agreement between simulated and measured radiation patterns is also obtained with a peak gain of 4.2 dBi.