首页> 外文会议>IEEE Asian Solid-State Circuits Conference >40-nm 64-kbit Buffer/Backup SRAM with 330 nW Standby Power at 65°C Using 3.3 V IO MOSs for PMIC less MCU in IoT Applications
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40-nm 64-kbit Buffer/Backup SRAM with 330 nW Standby Power at 65°C Using 3.3 V IO MOSs for PMIC less MCU in IoT Applications

机译:在65°C时具有330nW待机功率的40nm 64kbit缓冲/备份SRAM,使用3.3V IO MOS用于IoT应用中的无PMIC MCU

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An effective standby power reduction of buffer/backup SRAM in MCU is proposed for power module IC (PMIC) less edge system in IoT applications. The proposed SRAM macro is implemented using 3.3 V thick-gate-oxide IO MOSs for effectively reducing the leakage power with source bias control techniques. Four multiples interleave wordline circuitry is also introduced to reduce read and write operating power. A test chip with 64-kbit SRAM macro is designed and fabricated using 40-nm technology. The measured data show that the leakage power is 330 nW at 65°C (47 nW at 25°C), which is 1/140 of other works. The read/write power is reduced by 60% by interleave wordline circuitry.
机译:针对物联网应用中功率模块IC(PMIC)较少的边缘系统,提出了一种有效降低MCU中缓冲/备份SRAM待机功耗的方案。拟议的SRAM宏使用3.3 V厚栅极氧化物IO MOS实现,可通过源极偏置控制技术有效降低泄漏功率。还引入了四倍交错字线电路,以降低读写操作功率。使用40 nm技术设计和制造具有64 kbit SRAM宏的测试芯片。测量数据表明,在65°C下的泄漏功率为330 nW(在25°C下的泄漏功率为47 nW),是其他功的1/140。交错字线电路可将读/写功率降低60%。

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