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Tutorial: The uncertain end to silicon

机译:教程:硅的不确定性终结

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As silicon technology moves progressively to ever smaller geometries, the uncertainties in the devices, due to atomic level imperfections and processing options become an ever larger factor in the design of systems-on-chip. The variabilities, mismatch and noise of 20nm and below process geometries dominate the design of these integrated circuits, affecting memory circuitry, analog blocks, digital logic and RF interfaces. We here discuss design practices to minimize systematic and random mismatch in memory blocks. We also discuss the emergence of Random Telegraph Noise in memory units. Design techniques for analog modules susceptible to mismatch and noise are considered, as are logic operation, guardbanding and operating stresses in the presence of these design uncertainties. RF operation is highly susceptible to phase noise issues, and limits, and mitigation methods are described. All these effects mean longer design cycles, and require operating safety margins that reduce the effectiveness of moving to the next process node. We investigate the question of whether it will be this type of process effect that will eventually stop silicon technology from advancing further.
机译:随着硅技术逐渐发展到越来越小的几何形状,由于原子级缺陷和处理选项而导致的设备不确定性成为片上系统设计中越来越大的因素。 20nm及以下工艺几何尺寸的变化,失配和噪声支配着这些集成电路的设计,从而影响了存储电路,模拟模块,数字逻辑和RF接口。我们在这里讨论最小化存储块中系统性和随机性不匹配的设计实践。我们还将讨论存储单元中随机电报噪声的出现。在存在这些设计不确定性的情况下,考虑了易失配和噪声的模拟模块的设计技术,以及逻辑操作,保护带和操作应力。 RF操作极易受到相位噪声问题的影响,并介绍了限制和缓解方法。所有这些影响意味着更长的设计周期,并且需要一定的操作安全余量,从而降低了转移到下一个工艺节点的效率。我们研究的问题是,这种处理效果是否会最终阻止硅技术的进一步发展。

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