Decoupling Capacitors Techniques For High-Frequency Board Designs

摘要

This paper describes a design and verification methodology for a board level decoupling capacitor strategy. It focuses on the effectiveness of decoupling capacitors at multiple packaging levels. The capacitor design, placement and modeling approach is discussed including the properties of real capacitors. The model simulation is justified by actual hardware measurements using a state-of-the-art PowerPCTM microprocessor design. The power supply circuit for the entire system is analyzed in both the frequency and time domain to determine the design parameter sensitivities. Finally, power supply design guidelines and recommendations are presented using a PowerPC microprocessor design as an example.