Creep Behavior of A Silicon Nitride with Various Specimen/ Loading Configurations, and Creep Prediction Using the Cares/Creep Program

摘要

Creep behavior of a hot-pressed silicon nitride was determined at 1300℃ in air using four different specimen/loading configuration such as pure tension, pure compression, uniaxial flexure and biaxial flexure. For a given applied stress, creep strain rate was highest for pure tension, intermediate for uniaxial flexure, and was lowest for pure compression. It was found that there was no apparent difference in the creep parameter (stress exponent) associated with stress among three different specimen/loading configurations. A prediction of creep deformation for one representative case of uniaxial flexure subjected to an applied stress 163 MPa was made using the CARES/CREEP compute code, based on the obtained pure tension and compression creep data.