首页> 外文会议>Fourth International Symposium on Non-CO2 Greenhouse Gases (NCGG-4): Science, Control, Policy and Implementation >Philips Semiconductors policy and strategy to reduce globalwarming by PFC emissions
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Philips Semiconductors policy and strategy to reduce globalwarming by PFC emissions

机译:飞利浦半导体公司通过PFC排放减少全球变暖的政策和策略

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Perfluorinated compounds (PFC's) emissions contribute largely to global warming caused by the semiconductor (SC) industry.Typically,PFC's are long-lived and strongly absorbIR radiation.Moreover,the PFC use by the global semiconductor industry increases rapidly and the estimated PFC consumption in 2010 will be 7-10 times higher than in 1995.In that perspective,the European semiconductor industry has agreed to reduce global warming by PFC’s with10% in 2010 relative to the 1995 baseline,as laid down in the voluntary Memorandum ofAgreement (MOA).This corresponds with more than c.90% reduction on the basis of the estimatedPFC use in 2010.In comparison with mainstream device manufacturers,Philips Semiconductors has awide product portfolio.The large variety of other than standard,typical product andprocess requirements,of product and process mixes and of machines,makes this reductiontarget an even tougher challenge.In order to achieve these highly ambitious targets,Philips Semiconductors has drawn upa PFC emissions reduction roadmap.This roadmap comprises studies of possible solutions,as well as implementation strategies.Possible solutions being examined includeprocess optimizations (reduction of PFC consumption in connection with lower emissions),developments of alternative processes (based on substitutes with lower GWP thusallowing lower global warming impact) and evaluations of downstream abatement options(destruction of PFC compounds in gaseous effluent streams).In this presentation the roadmap and the organization to realize the ambitions will be explained.Potential problems,which may arise when PFC emission reducing measures areimplemented in an existing production setting,are discussed.
机译:全氟化合物(PFC)的排放在很大程度上导致了半导体(SC)行业引起的全球变暖。典型地,PFC寿命长且吸收IR辐射很大。此外,全球半导体行业对PFC的使用迅速增加,估计PFC的消费量在2010年将是1995年的7到10倍。从这个角度来看,欧洲半导体行业已同意按照自愿协议备忘录(MOA)的规定,在2010年将PFC的全球变暖程度相对于1995年的基准减少10%。与2010年基于PFC的估计使用量相比,这相当于减少了约90%。与主流设备制造商相比,飞利浦半导体拥有广泛的产品组合。除了标准,典型产品和工艺要求之外,产品和产品的种类繁多。工艺混合物和机器,使降低目标的难度更大。为了实现这些雄心勃勃的目标,飞利浦半导体起草了PFC减排路线图。该路线图包括对可能解决方案的研究以及实施策略。正在研究的可能解决方案包括流程优化(与较低排放量相关的PFC消耗量减少),替代流程的开发(基于全球升温潜能值较低的替代品)因此,可以降低全球变暖的影响)并评估下游的减排方案(销毁气态废水中的PFC化合物)。在本演示文稿中,将解释路线图和实现这一目标的组织。在减少PFC排放措施时可能会出现潜在问题。讨论了在现有生产环境中实施的方法。

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