Abstract: thography technology is moving towards deep UV wavelengths in order to obtain smaller feature sizes on integrated circuits. Optical glasses are being replaced with fused silica because of the DUV application. There are concerns that the short pulse, high instantaneous power generated with excimer lasers can cause structural changes in the fused silica materials. The damage includes: changing absorption, observed fluorescence, and induced stress birefringence. This paper will address the laser damage testing protocol for fused silica. We will discuss the setup, equipment, and procedures for laser damaging. Precision measurements of the absorption, fluorescence, and stress birefringence are required to have a good understanding of the laser damage. The paper will also address the equipment problems associated with these measurements and initial comparisons between 193 nm and 248 nm laser damage.!4
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