首页> 外文会议>EuSPEN(European Society for Precision Engineering and Nanotechnology) International Conference; 20040531-0602; Glasgow(GB) >Ultra precision milling of mechanical components and functionality systems for optical and electro optical modules
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Ultra precision milling of mechanical components and functionality systems for optical and electro optical modules

机译:用于光学和电光学模块的机械组件和功能系统的超精密铣削

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In the preparation of the mass production of semiconductor modules, the manufacture of function-prototypes is an indispensable step towards the assessment of the future functionality. These prototypes are conventionally produced by technologies used in the semiconductor technology. This paper shows that the manufacture of functional patterns using an ultra precision machining system is possible in a very short process chain. This technology allows to manufacture structures such as V-grooves, as well as cavities with conical, pyramid, or square transverse sections with a geometrical accuracy of sub-micrometers and, if necessary, with an optical surface quality, allowing optical functions. Materials used are metals such as brass, German silver, but also semiconductor materials, ceramics, and glass. This paper presents the results of milling operations with monocrystalline diamonds in copper, German silver, and silicon.
机译:在大规模生产半导体模块的过程中,功能原型的制造是评估未来功能的必不可少的步骤。这些原型通常由半导体技术中使用的技术生产。本文表明,可以在非常短的过程链中使用超精密加工系统制造功能性图案。这项技术可以制造V型槽等结构,以及具有圆锥形,棱锥形或方形横截面的型腔,其几何精度可达到亚微米,并且在必要时具有光学表面质量,可以实现光学功能。使用的材料是金属,例如黄铜,德国银,还有半导体材料,陶瓷和玻璃。本文介绍了用铜,德国银和硅进行单晶金刚石铣削的结果。

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