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Etching of Germanium in Hydrogen Peroxide Solutions

机译:过氧化氢溶液中锗的蚀刻

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摘要

In this paper, the etching behaviour of germanium in hydrogen peroxide solutions is described. Electrochemical experiments showed that the etching process is most probably purely chemical. The etch rate was found to depend upon the H_2O_2 concentration, the pH value, the amount of KC1 in the solution and , in some cases, upon the rotation rate. Based on all of these findings, possible etching mechanisms for Ge in H_2O_2 are discussed on a molecular level.
机译:本文描述了锗在过氧化氢溶液中的腐蚀行为。电化学实验表明,蚀刻过程很可能是纯化学过程。发现蚀刻速率取决于H_2O_2浓度,pH值,溶液中KCl的量,并且在某些情况下取决于旋转速率。基于所有这些发现,在分子水平上讨论了H_2O_2中Ge的可能腐蚀机理。

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