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ELECTRICAL PROPERTIES OF Au/POLYMER INTERFACES

机译:Au /聚合物界面的电学性质

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摘要

A trap-free Molecularly Doped hole-transport Polymer (MDP) provides a model system for the study of metal/polymer interfaces by enabling the use of a recently developed technique that supplies a quantitative measure of contact injection efficiency. The technique combines field-dependent injection current measurements from a contact under test with time-of-flighl (TOF) mobility measurements on the same sample. In the present case, MDP films were prepared with two top vapor-deposited contacts, one of Au (test contact) and one of Al (for TOF), and a bottom carbon-loaded polyimidc electrode. An unusual phenomenon is investigated whereby injection from Au is initially blocking, evolving to ohmic over time. This contrasts with the behavior expected according to the relative workfunctions of Au and of the polymer whereby Au should inject holes efficiently. The samples were aged al various temperatures below the glass transition of the polymer (85℃) and the evolution of current-field measurements and of capacitance is followed in detail over time and analyzed. All Au contacts eventually achieved ohmic injection. Rapid sequence data acquisition enabled the separation of two main processes in the injection evolution. Control measurements ensure that the evolution of the electrical properties is due to the Au/polymer interface behavior and not the bulk. The behavior of Au contacts evaporated under various deposition conditions was compared. Transmission electron microscopy results at the Au/MDP interface were obtained as both a function of time and of deposition conditions. Mechanisms operating at the interface of the evaporated Au films on the polymer are discussed.
机译:无陷阱分子掺杂空穴传输聚合物(MDP)通过使用最新开发的技术来定量研究接触注入效率,为研究金属/聚合物界面提供了模型系统。该技术将来自被测触点的场相关注入电流测量结果与同一样品的迁移时间(TOF)迁移率测量结果结合在一起。在当前情况下,制备MDP膜时要使用两个顶部气相沉积触点,一个为Au(测试触点),另一个为Al(用于TOF),以及一个底部装有碳的聚酰亚胺电极。研究了一种不寻常的现象,即金的注入最初受阻,随着时间的推移逐渐发展为欧姆。这与根据Au和聚合物的相对功函所预期的行为相反,由此Au应当有效地注入空穴。在低于聚合物的玻璃化转变温度(85℃)的各种温度下对样品进行老化,并随时间详细跟踪并分析电流场测量值和电容的变化。所有的金触点最终都实现了欧姆注入。快速的序列数据采集可实现进样过程中两个主要过程的分离。控制测量可确保电性能的演变是由于Au /聚合物界面行为而不是由于体积。比较了在各种沉积条件下蒸发的金触点的行为。在Au / MDP界面上的透射电子显微镜结果既是时间的函数,也是沉积条件的函数。讨论了在聚合物上蒸发的Au膜的界面上运行的机理。

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  • 会议地点 Boston MA(US)
  • 作者单位

    Center lor Photoinduced Charge Transfer, University of Rochester, Rochester NY 14627 Wilson Center for Research and Technology, Xerox Corp.,800 Phillips, 114-39D, Webster, NY 14580;

    Center lor Photoinduced Charge Transfer, University of Rochester, Rochester NY 14627 Wilson Center for Research and Technology, Xerox Corp.,800 Phillips, 114-39D, Webster, NY 14580;

    Center lor Photoinduced Charge Transfer, University of Rochester, Rochester NY 14627 Wilson Center for Research and Technology, Xerox Corp.,800 Phillips, 114-39D, Webster, NY 14580;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 有机质材料;
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