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Coreless Substrate Design, Assembly and Reliability for High Speed Applications

机译：高速应用的无芯基板设计，组装和可靠性

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来源
《Device packaging 2010 》|2010年|p.1-2|共2页
会议地点 Scottsdale/Fountain Hills AZ(US)
作者
Jon Aday; Nozad Karim; Mike Devita; Steven Lee;
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作者单位

jon.aday@amkor.com;

nozad.karim@amkor.com;

mike.devita@amkor.com;

stevel@amkor.com;

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会议组织
原文格式 PDF
正文语种 eng
中图分类制造工艺 ;
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Coreless Substrate Design, Assembly and Reliability for High Speed Applications

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