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Shape memory alloy film for deployment and control of membrane apertures

机译:形状记忆合金膜,用于膜孔的展开和控制

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摘要

Nickel Titanium (NiTi) film shape memory alloy (SMA) is integrated with space-qualified polymer and mesh materials for potential use as deployment mechanisms and actuation of flexible space apertures. SMA thin film is successfully applied to Astromesh~(TM) metal mesh, Kapton, Upilex, and CP-1 polymer films. Sputter deposition of NiTi onto the substrate is used to validate the material system process and demonstrate the NiTi deployment capability. Although successful, the relatively high processing temperatures required to crystallize NiTi onto the substrates requires care. A second approach is demonstrated that deposits NiTi onto a silicon substrate, followed by coating the NiTi with the desired polymer, e.g. CP-1. Micro-electro-mechanical (MEMS) processing steps are then used to remove the silicon substrate beneath the NiTi, thus freeing up the composite membrane (i.e. NiTi + CP-1). Using MEMS fabrication techniques, a hot-shaped small dome shape structure is shaped into the NiTi before deposition of the CP-1 polymer. Activation of the integrated SMA/CP-1 produces deformation of this composite structure without damage. The test articles demonstrate the feasibility to both grossly deploy and locally actuate space-qualified polymer materials.
机译:镍钛(NiTi)膜形状记忆合金(SMA)与符合空间要求的聚合物和网状材料集成在一起,有可能用作展开机构和驱动柔性空间孔。 SMA薄膜已成功应用于AstromeshTM金属网,Kapton,Upilex和CP-1聚合物薄膜。将NiTi溅射沉积到基板上可用于验证材料系统工艺并演示NiTi部署能力。尽管成功,但需要注意将NiTi结晶到基板上所需的相对较高的处理温度。证明了第二种方法,该方法将NiTi沉积在硅衬底上,然后用所需的聚合物例如Ni / Si涂覆NiTi。 CP-1。然后使用微机电(MEMS)处理步骤去除NiTi下方的硅基板,从而释放出复合膜(即NiTi + CP-1)。使用MEMS制造技术,在沉积CP-1聚合物之前,将热形的小圆顶形状的结构成型为NiTi。集成的SMA / CP-1的激活会产生此复合结构的变形而不会损坏。测试文章证明了总体部署和局部驱动符合太空要求的聚合物材料的可行性。

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