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Chip-scale Integration of VCSEL, Photodetector, and Microlens Arrays

机译:VCSEL,光电检测器和微透镜阵列的芯片级集成

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摘要

New generations of network application continue to demand component solutions of higher speed (10 Gbps and beyond) with good reliability and affordability. The potential of VCSEL arrays technology in meeting those demands has long been recognized and is being actively explored by many in the field. In this paper we present a few examples of VCSEL array based technology developments including monolithic integration of VCSELs an photodetector (PD) in both 1D and 2D arrays, and their hybrid integration with micro-lens array and electronic integrated circuits for optical interconnects. As we explore to achieve more functionality through integration, we also emphasize on the merits of usability of the electrical and optical interfaces of the new components, and producibility and manufacturability aspects of the new technologies.
机译:新一代网络应用程序继续要求具有良好可靠性和可承受性的更高速度(10 Gbps及更高)的组件解决方案。长期以来,VCSEL阵列技术在满足这些需求方面的潜力已得到认可,并且正在本领域的许多人中积极探索。在本文中,我们介绍了一些基于VCSEL阵列的技术开发示例,包括VCSEL的单片集成,一维和二维阵列中的光电检测器(PD),以及它们与微透镜阵列和用于光学互连的电子集成电路的混合集成。当我们探索通过集成来实现更多功能时,我们还强调了新组件的电气和光学接口的可用性以及新技术的可生产性和可制造性方面的优点。

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