首页> 外文会议>Conference on Optical Components and Materials; 20080121-23; San Jose,CA(US) >Ion implantation of B ions into CdHgTe/CdZnTe substrate and determination of optimum optical characteristics for making diode p-n structures in narrow(-band)-gap semiconductor material CdHgTe/CdZnTe
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Ion implantation of B ions into CdHgTe/CdZnTe substrate and determination of optimum optical characteristics for making diode p-n structures in narrow(-band)-gap semiconductor material CdHgTe/CdZnTe

机译:将B离子注入CdHgTe / CdZnTe衬底中并确定在窄带隙半导体材料CdHgTe / CdZnTe中制备二极管p-n结构的最佳光学特性

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The samples were prepared from CdZnTe substrate with thickness of 600μm, on wich thin CdHgTe (KRT) thin films with thicknesses of 16μm, 18.75 μm and the same sample with KRT thin film with thickness 21.6μm was coated by diamond thin film with thickness of 30nm. B ion implantation into KRT film on CdZnTe substrate was made with purpose of investigation of volt-ampere characteristics and defects formation. Ion doping of B in KRT with doses of (D=3.4 mCl/cm2, D=6.8 mCl/cm2) and energies (50 keV, 100 keV, 150 keV). The calculations by SRIM-TRIM 2003 software for condition of maximum ion distribution on the interface "film-substrate" have shown that the optimal energy is 100 keV for all mentioned samples. The results also have shown that implantation at ions energy 100 keV is optimal for form diode p-n structures in narrow(-band)-gap semiconductor material CdHgTe/CdZnTe.
机译:样品由厚度为600μm的CdZnTe衬底制备,在厚度分别为16μm,18.75μm的薄CdHgTe(KRT)薄膜上制备,相同的样品和厚度为21.6μm的KRT薄膜均涂覆有厚度为30nm的金刚石薄膜。为了研究伏安特性和缺陷形成,将B离子注入到CdZnTe衬底上的KRT膜中。 KRT中B的离子掺杂剂量为(D = 3.4 mCl / cm2,D = 6.8 mCl / cm2)和能量(50 keV,100 keV,150 keV)。通过SRIM-TRIM 2003软件计算的“离子在膜-基底”界面上的最大离子分布条件的计算表明,所有提到的样品的最佳能量为100 keV。结果还表明,对于窄(带)隙半导体材料CdHgTe / CdZnTe中形成二极管p-n结构,以100 keV的离子能量注入是最佳的。

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