首页> 外文会议>Conference on Nanotubes and Nanowires; Aug 3-4, 2003; San Diego, California, USA >Energy dependent total thermal neutron scattering cross-section and transport of a neutron pulse in Fullerite at 300 K
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Energy dependent total thermal neutron scattering cross-section and transport of a neutron pulse in Fullerite at 300 K

机译:能量依赖的总热中子散射截面和300 K富勒石中的中子脉冲传输

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Crystalline fullerene-fullerite- is a molecular crystal and therefore possesses a number of dynamical modes: librational, orientational diffusive, tunneling and optical, in addition to the usual anisotropic translational modes. Making use of these dynamical modes a thermal neutron scattering kernel for fullerite has been developed. The total scattering cross-sections of thermal neutrons have been computed in the energy range 10~(-4) - 0.3 eV. For inelastic scattering while one phonon and two phonon processes are sufficient, for libron exchanges as many as thirteen libron quanta exchanges have to be considered. Using the thermal neutron scattering kernel the multigroup Boltzmann transport equation has been diagonalized, to obtain the eigenvalues and the corresponding eigenfunctions of a neutron pulse propagating in the medium. The variation of lowest eigenvalue with the size of the assembly is compared with the corresponding measured values in graphite and it turns out to be slower in smaller assemblies of fullerite. The time dependent thermalization of the neutron pulse, introduced in the assembly at time t=0, has also been computed. While in large assemblies (B~2=0.0006 cm~(-2)) the high energy neutron pulse gets thermalised in about 1500 μs, it takes as long as 5000 μs in smaller assemblies (B~2=0.005 cm~(-2)).
机译:晶体富勒烯-富勒体-是一种分子晶体,因此除通常的各向异性平移模式外,还具有许多动力学模式:自由,定向扩散,隧穿和光学。利用这些动力学模式,已经开发了用于富勒石的热中子散射核。计算出了中子的总散射截面,其能量范围为10〜(-4)-0.3 eV。对于非弹性散射,一个声子和两个声子过程就足够了,对于libron交换,必须考虑多达13个libron量子交换。使用热中子散射核将多组玻尔兹曼输运方程对角化,以获得在介质中传播的中子脉冲的本征值和相应的本征函数。将最低特征值随组件尺寸的变化与石墨中相应的测量值进行比较,结果发现在较小的富勒石组件中,该特征值的变化较慢。还计算了在时间t = 0引入组件的中子脉冲随时间的热化。在大型组件中(B〜2 = 0.0006 cm〜(-2)),高能中子脉冲在约1500μs内被热化,而在小型组件中(B〜2 = 0.005 cm〜(-2) ))。

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