Advanced Visible / Infrared Microcameras for Dual Use Applications

摘要

Irvine Sensors Corporation (ISC) has pioneered the use of a chip stacking technology that allows an entire electronics systems to be packaged into a single 3-dimensional cube of electronics. This stacking approach allows the elimination of traditional printed circuit boards (PCB) and as a result significantly reduces the size of the electronics. Recently this technology has been applied to electronic camera applications including both high-resolution digital still picture and video camera technologies. In addition this electronics implementation approach is under evaluation for application in the SWIR and LWIR/thermal imaging spectral bands.