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A 30 V class extremely low on-resistance meshed trench lateral power MOSFET

机译:30 V类极低导通电阻的网状沟槽横向功率MOSFET

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摘要

A meshed trench lateral power MOSFET with a trench bottom source contact (M-TLPM/S) is proposed, fabricated, and characterized. The M-TLPM/S is formed along the sidewalls of the meshed trench. The trench bottom source contact is formed between the drain islands in one direction only (contact area), resulting in increased channel density in reduced cell pitch. The fabricated M-TLPM/S features device pitches in the contact and gate areas of 3.0 μm and 1.3 μm respectively, and exhibits a specific on-resistance of 8.4 mΩ-mm2 for a breakdown voltage of 31 V.
机译:提出,制造并表征了具有沟槽底部源极接触(M-TLPM / S)的网状沟槽横向功率MOSFET。 M-TLPM / S沿着网状沟槽的侧壁形成。沟槽底部源极接触仅在一个方向(接触区域)之间形成在漏极岛之间,导致沟道密度减小而单元间距减小。所制造的M-TLPM / S在接触和栅极区域的器件间距分别为3.0μm和1.3μm,对于击穿电压为31的器件,其导通电阻为8.4mΩ-mm 2 V.

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