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STRUCTURAL RECONSTITUTION IN POLYMER MATRIX COMPOSITES AND ITS SIGNIFICANCE FOR PERFORMANCE AND FUNCTIONALITY

机译:聚合物基复合材料的结构重构及其对性能和功能的意义

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Using a combination of inelastic light scattering and atomic scale simulations, we investigated the structure and properties of thermoset polymeric materials, while reversibly removed from their thermodynamic ground state. In one set of experiments we measured the adiabatic elastic modulus of epoxy in situ, while undergoing polymerization and cross-linking reactions. Throughout the experiment, the degree of cure was monitored using Raman light scattering (RLS), while the adiabatic modulus was measured using Brillouin light scattering (BLS). Since these are both inelastic light scattering techniques, RLS and BLS are carried out concurrently, i.e., the respective spectra were collected from the same location in the specimen and at the same time, allowing us to directly compare the modulus with the degree. As illustrate in Fig. 1, we find that the adiabatic modulus of the polymer evolves non-uniquely as a function of cure degree; it strongly depends on the cure rate. We can explain the observed behavior by taking into account that two mechanisms contribute to the increase in the elastic modulus of the material during curing. First, there is the formation of covalent bonds in the network during the curing process. While the formation of these bonds lowers the electronic structure energy of the system, atoms are still somewhat removed from their ground state positions. Hence, in a second process the structure undergoes structural reconstitution toward a more optimally packed configuration of the network, which enhances non-bonding interactions. Both contributions are apparent in the adiabatic modulus derived from Brillouin scattering, as it reflects the elastic response of the polymer network in thermodynamic equilibrium. To further ascertain the notion of structural reconstitution, which is affecting only non-bonding interactions, we subject a fully cured epoxy to various degrees of strain, well within the elastic regime, using a miniature tensile tester mounted in the beam path of the light scattering setup, while simultaneously measuring the adiabatic and isothermal elastic moduli as a function of the applied strain. We find that straining this polymer network is equivalent to forming the bonds between its atoms while these are in locations displaced from the structural ground state. The fact that the polymer structure can reconstitute after undergoing appreciable deformation opens new ways of thinking about its applicability in terms of functionality and performance. Molecular simulations provide additional insights into the underlying mechanisms, and delineate the blueprints for materials design.
机译:通过结合使用非弹性光散射和原子尺度模拟,我们研究了热固性聚合物材料的结构和性能,同时可逆地将其从热力学基态中移除。在一组实验中,我们在进行聚合和交联反应的同时,现场测量了环氧树脂的绝热弹性模量。在整个实验中,使用拉曼光散射(RLS)监控固化程度,而使用布里渊光散射(BLS)来测量绝热模量。由于这两种都是非弹性光散射技术,因此RLS和BLS同时进行,即从样品的同一位置同时采集各自的光谱,从而使我们可以直接将模量与度数进行比较。如图1所示,我们发现聚合物的绝热模量随固化度的变化而非均一地发展。这在很大程度上取决于治愈率。我们可以通过考虑两个机理来解释固化过程中材料弹性模量的增加,从而解释观察到的行为。首先,在固化过程中网络中会形成共价键。尽管这些键的形成降低了系统的电子结构能,但原子仍从其基态位置移走了一些。因此,在第二个过程中,结构将结构重构为网络的最佳打包配置,从而增强了非绑定相互作用。这两种贡献在源自布里渊散射的绝热模量中都很明显,因为它反映了热力学平衡中聚合物网络的弹性响应。为了进一步确定仅影响非键相互作用的结构重建的概念,我们使用安装在光散射光路中的微型拉伸测试仪,对完全固化的环氧树脂在弹性范围内进行了不同程度的应变处理。设置,同时测量绝热和等温弹性模量与所施加应变的关系。我们发现,拉紧该聚合物网络等效于在它们的原子之间偏离结构基态的位置之间形成键。聚合物结构在经历相当大的变形后可以重新构成的事实开辟了从功能和性能方面考虑其适用性的新方法。分子模拟提供了对潜在机理的更多见解,并描绘了材料设计的蓝图。

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