INTERFACIAL EVOLUTION OF Al/Cu LAMINATED COMPOSITE PRODUCED BY ASYMMETRICAL ROLL BONDING AND ANNEALING

摘要

Laminated composites have attracting much more attentions due to the combination of mechanical and physical properties between dissimilar metals, especially for the considerable interface effect on the microstructure and performance. In this paper, the Al/Cu bimetallic laminated composite has been fabricated through asymmetrical roll bonding and subsequent annealing technique. The effect of deformation and temperature on interfacial microstructure was studied based on the SEM and TEM observation. The results found that interfacial difference is distinct due to the different shear deformation condition during asymmetrical roll bonding process. The annealing temperature plays an important role on the dynamic growth of interfacial interlayer. The characterization of the intermetallic compound formed in the interface was conducted to understand the interfacial evolution.