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Dynamic Reactive Wetting and its Role in Hot Dip Coating

机译:动态反应润湿及其在热浸涂层中的作用

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The effect of substrate preheat temperature on the dynamic wetting of 55Al-43.4Zn-l.6Si hot dip coating melts on low carbon steel substrates has been investigated. An experimental apparatus based on the sessile drop technique was developed which allowed the substrate to be preheated to a different temperature than the bath. The initial wetting and spreading of a molten metal droplet on a substrate was recorded at 1000 frames per second using a high speed digital camera. Wetting was improved (θ decreased from 120°to 25°) as the substrate preheat temperature was increased and approached the bath temperature, beyond which the improvement in wetting was negligible. Immersion experiments using a thermocouple instrumented substrate dipped into a coating bath were performed for varying substrate preheat temperatures. Interfacial heat fluxes and interfacial resistances were calculated from the temperature responses. The "minimum" interfacial resistance was decreased by an order of magnitude (1x10~(-4) to 2x10~(-5) m~2K/W) as the substrate preheat temperature was increased from room to bath temperature. The reduction in interfacial resistance was related to the improvement of the initial wetting and the increase in mass transfer of iron atoms from the substrate across the interface. There was an apparent increase in the "minimum" interfacial resistance for substrate temperatures greater than the bath temperature. This was due to the increased rate of alloy layer formation and the exothermic nature of the reactions. The significance of these findings was discussed with respect to the mechanism of alloy layer formation at the interface during the initial stages of solid-liquid contact.
机译:研究了基材预热温度对低碳钢基材上55Al-43.4Zn-1.Si热浸镀层熔体动态润湿的影响。开发了一种基于固定滴技术的实验设备,该设备可以将基板预热至与镀液不同的温度。使用高速数码相机以每秒1000帧的速度记录熔融金属滴在基材上的初始润湿和铺展。随着基材预热温度的增加并接近熔池温度,润湿性得到改善(θ从120°降至25°),在此之上,润湿性的改进可忽略不计。使用热电偶仪器浸入涂层浴中的浸入实验进行了不同的基板预热温度。从温度响应计算出界面热通量和界面电阻。随着基底预热温度从室温升高到浴温,“最小”界面电阻降低了一个数量级(1x10〜(-4)到2x10〜(-5)m〜2K / W)。界面电阻的降低与初始润湿性的改善以及铁原子从基材穿过界面的传质的增加有关。对于大于熔池温度的基材温度,“最小”界面电阻明显增加。这是由于增加了合金层的形成速率和反应的放热性质。讨论了这些发现的意义,涉及固液接触初始阶段界面处合金层形成的机理。

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