首页> 外文会议>ASME conference on smart materials, adaptive structures and intelligent systems 2008 >INFLUENCE OF CYCLIC LOADING AND TEMPERATURE ON INTEGRITY OF PIEZOCERAMIC PATCH TRANSDUCERS
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INFLUENCE OF CYCLIC LOADING AND TEMPERATURE ON INTEGRITY OF PIEZOCERAMIC PATCH TRANSDUCERS

机译:循环载荷和温度对压电陶瓷斑片传感器完整性的影响

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摘要

In this study the loading limits, damage behavior and long-term integrity of piezoceramic patch transducers, based on monolithic PZT wafers (PIC 255) were investigated. The presented results involve quasi-static and long-term cyclic testing under tensile as well as compressive mechanical loading of the patches, under varied temperatures. Also long-term cyclic electric activation was investigated.rnA strain-cycle life-span diagram was established for tensile loading at room temperature (RT), +60 ℃, +100 ℃ and -40 ℃. In all cases cracking in the PZT ceramic was found to be the relevant failure mechanism which could be correlated to the observed degradation of the patches' sensor performance. Preliminary investigations with fracture mechanics methods were carried out on the specimen with fractured PZT wafers. No mechanical damage was found under compressive loading at strain levels of up to -0.6 %.rnFinite element analyses were performed using 3D material modeling with electromechanical coupling behavior, achieving very good predictability of the sensor and actuator performance. Analytical calculations and numerical simulation were used to interpret experimental findings and also allow the transfer of results to various applications.
机译:在这项研究中,研究了基于整体式PZT晶片(PIC 255)的压电陶瓷贴片换能器的载荷极限,损伤行为和长期完整性。提出的结果涉及在温度变化的情况下,在贴片的拉伸以及压缩机械载荷下进行准静态和长期循环测试。还研究了长期循环电活化。建立了室温(RT),+ 60℃,+ 100℃和-40℃时的拉伸载荷应变周期寿命图。在所有情况下,发现PZT陶瓷中的裂纹都是相关的失效机理,这可能与所观察到的贴片传感器性能下降有关。使用断裂的PZT晶片样品对断裂力学方法进行了初步研究。在高达-0.6%的应变水平下的压缩载荷下未发现机械损坏。使用具有机电耦合特性的3D材料建模对有限元进行了分析,从而实现了传感器和执行器性能的良好可预测性。分析计算和数值模拟用于解释实验结果,也可以将结果转移到各种应用程序中。

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