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High – speed, 2D VCSEL arrays at 990nm for short reach interconnects

机译:990nm的高速2D VCSEL阵列,用于短距离互连

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We have demonstrated high density, 2D (4x12) VCSEL arrays operating at an aggregate data rate of over480Gb/s in an aerial density of 1400x3750 μm2, or 9.14 Tbs/cm2. These flip-chip, bottom-emitting 990nmVCSELs have low drive voltage, low electrical parasitics, improved thermal impedance and 2Dscalability over their wire-bonded top emitting counterparts. Excellent high speed performance wasobtained through the use of 1) compressively strained InGaAs MQW active region 2) low parasiticcapacitance oxide-confined VCSEL structures and 3) low series resistance, high index contrastAlGaAs/GaAs mirrors. 10Gb/s operation was obtained with low operating current density of ~6kA/cm2at 70oC. Our best results to date have achieved data rates greater than 15Gb/s @70oC at a current densityless than 10kA/cm2. The device results show good agreement with theoretically calculated/simulatedvalues.
机译:我们已经展示了高密度2D(4x12)VCSEL阵列,其总数据速率超过 空中密度1400x3750μm2时为480Gb / s,即9.14 Tbs / cm2。这些倒装芯片,底部发射的990nm VCSEL具有低驱动电压,低电寄生性,改善的热阻和2D 相对于引线键合顶部发射同行的可扩展性。出色的高速性能当时 通过使用1)压缩应变的InGaAs MQW有源区获得2)低寄生 电容氧化物限制的VCSEL结构和3)低串联电阻,高折射率对比度 AlGaAs / GaAs镜。以〜6kA / cm2的低工作电流密度实现了10Gb / s的工作 在70oC。迄今为止,我们的最佳结果是在电流密度为70oC时,数据速率超过15Gb / s 小于10kA / cm2。器件结果与理论计算/仿真结果吻合良好 价值观。

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