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An ILP formulation for application mapping onto Network-on-Chips

机译:用于将应用程序映射到片上网络的ILP公式

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Ever shrinking technologies in VLSI era made it possible to place several modules onto a single die. However, the need for the new communication methods has also increased dramatically since traditional bus-based systems suffer from signal propagation delays, signal integrity, and scalability. Network-on-Chip (NoC) is the biggest step towards the communication bottleneck of System-on-Chip (SoC) architectures. In this paper, we present an Integer Linear Programming (ILP) formulation for application mapping onto mesh based Network-on-Chips to minimize the energy consumption of the system. The proposed method obtains optimal or close to optimal results within the given computation time limit. We also experimentally investigate the impact of the size of the mesh architecture on the application mapping and total communication.
机译:VLSI时代不断缩小的技术使将多个模块放置在单个芯片上成为可能。但是,由于传统的基于总线的系统遭受信号传播延迟,信号完整性和可伸缩性的困扰,因此对新通信方法的需求也急剧增加。片上网络(NoC)是朝着片上系统(SoC)体系结构的通信瓶颈迈出的最大一步。在本文中,我们提出了一种整数线性规划(ILP)公式,用于将应用程序映射到基于网格的基于芯片的网络上,以最大程度地减少系统的能耗。所提出的方法在给定的计算时间内获得了最佳或接近最佳的结果。我们还通过实验研究了网格体系结构的大小对应用程序映射和总体通信的影响。

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