The objective of Taiwan 3C (Computer, Communication, Consumer Electronic Product) manufacturers is to have the products as compact as possible. Light weight, good heat dissipation and EMI/RFI shielding are basic requirement for their components. Magnesium Alloys have the high specific mechanical strength and thermal conductivity, which seems offer the designer a wide variety of applications. Taiwan as a major manufacturer of portable PCs, have a strong driving force to develop magnesium-forming industry. Therefore recent development in magnesium forming industry and research activities are presented and discussed.
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