Sensing Sheets based on Large Area Electronics for Structural Health Monitoring of Bridges

摘要

Damage characterization often requires direct sensing due to the localization of the anomalous behavior near thecracks. Direct sensing, however, is expensive because of the need to deploy a dense array of individual sensors.Sensing sheets based on Large Area Electronics (LAE) and Integrated Circuits (ICs) are a novel solution to thisproblem. Such sensing sheets could span several square meters, with a dense array of strain sensors embedded ona polyimide substrate along with the relevant electronics allowing for direct sensing while keeping the costs low.Current studies on LAE based sensing sheets are limited to laboratory experiments. This paper explores thequestion of suitability of the sensing sheets as a viable option for real-life SHM based on LAE and ICs. Results oflaboratory experiments on an aluminum beam are provided to demonstrate the performance of sensing sheets inideal conditions. Then, the sensing sheets are employed on a pedestrian bridge already equipped with ber-opticsensors. The strain measurements from the sensing sheets and the ber-optic sensors are compared and sourcesof diu000berences are discussed.