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Unfolded Modular Multiplication

机译:展开式模乘

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Sedlak's [Sed] modular multiplication algorithm is one of the first real silicon implementations to speed up the RSA signature generation [RSA] on a smartcard, cf. [DQ]. Although it is nearly unknown in the scientific literature on cryptographic hardware it received in the practical smartcard world a considerable amount of interest, cf. [HP1, HP2,NMR]. The reason why it is so unknown might be given by the fact that the original publication was extremely hard to read and that Sedlak didn't explain all the subtle implementation issues. Theoretically, Sedlak's algorithm needs on average n/3 steps (i.e., additions/subtractions) to compute the modular product (α · β mod v) for α, β and v being n-bit numbers. The main result of this paper is that Sedlak's algorithm can be practically speeded up by an arbitrary integral factor i ≥ 2, i.e., our new algorithm needs on average n/(3 · i) steps in order to compute the modular product (α · βmod v). A further contribution of this paper is the mathematically proper and reader-friendly derivation of Sedlak's algorithm leading naturally to our main result.
机译:Sedlak的[Sed]模块化乘法算法是最早在智能卡上加速RSA签名生成[RSA]的真正芯片实现之一,请参阅。 [DQ]。尽管在有关加密硬件的科学文献中几乎不为人所知,但在实用的智能卡世界中却收到了相当大的兴趣,请参见。 [HP1,HP2,NMR]。之所以如此未知,可能是因为原始出版物非常难读,而Sedlak并未解释所有细微的实现问题。从理论上讲,Sedlak算法平均需要n / 3步(即加/减)来计算α,β和v为n位数字的模积(α·βmod v)。本文的主要结果是,可以通过任意积分因子i≥2实际提高Sedlak算法的速度,即,我们的新算法平均需要n /(3·i)步才能计算出模积(α· βmodv)。本文的另一贡献是Sedlak算法在数学上正确且易于阅读,这自然导致了我们的主要结果。

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