Thermal Analysis and Optimization in Radioss/OptiStruct Software

摘要

This paper presents an overview of the recently implemented thermal analysis and optimization capabilities in Altair Radioss/OptiStruct software. Conductive and convective thermal problems can be solved. Thermal analysis and coupled thermal-structural analysis are performed in a single analysis run. Design sensitivity analysis and optimization have been enhanced to support temperature responses, and coupled thermal structural optimization. Sizing and shape optimization can be performed for exclusive thermal optimization problems or coupled thermal-structural optimization problems. Numerical examples are presented to demonstrate these capabilities and the importance of update temperature load sensitivities in coupled thermal-structural optimization.