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A Truing Technique of Flattening Diamond Grains for Fabricating Microstructures with Fine Surfaces

机译:压扁金刚石晶粒以制造具有精细表面的微结构的修整技术

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A truing technique that can be used to shape the tip of an electroformed diamond tool into a hemisphere and flatten diamond grains on the tool working surface at the same level as the bond face was developed. A polycrystalline diamond disk whose top surface roughened by electrical discharge machining was partially flattened by grinding was used as a truer. Diamond grains on the tool working surface were successfully flattened along the hemispherical tool profile when the grains mesh size of #1000 was employed. In addition, a grinding test using glasslike carbon as a work material revealed that a surface roughness of less than 50 nm Rz could be obtained in both cases when moving the tool on contour and scanning paths.
机译:开发了一种可用于将电铸金刚石工具的尖端成形为半球并使工具工作表面上的金刚石晶粒平整到与粘结面相同水平的整平技术。将通过放电加工而粗糙化的顶表面通过研磨部分平坦化的多晶金刚石盘用作修整器。当使用#1000的晶粒尺寸时,工具工作表面上的金刚石晶粒可以成功地沿半球形工具轮廓展平。另外,使用玻璃状碳作为工作材料的磨削测试表明,在轮廓和扫描路径上移动工具时,两种情况下均可获得小于50 nm Rz的表面粗糙度。

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