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Energy variation of micro-cracking on Single Crystal Silicon

机译:单晶硅上微裂纹的能量变化

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The results from nano indentation is employed to study the mechanical behaviour of materials at nanometric scale. Based on the extensive experiments using nano indentation, a new phenomenon is discovered in understanding micro cracking on single crystal silicon. Thus, a new method is proposed in evaluating the micro cracks occurring, i.e., an increasing rate of absorbed energy, which is significant in examining the brittle-to-ductile transition of single crystal silicon. This method provides a simple approach in understanding the micro cracks, while it is very tedious in conventional method. Experimental studies reveal that the increasing rale of absorbed energy in nano indentation presents an identical correlation to the surface cracks on single crystal silicon surfaces.
机译:纳米压痕的结果用于研究纳米尺度材料的机械性能。基于使用纳米压痕的广泛实验,在理解单晶硅上的微裂纹方面发现了一种新现象。因此,提出了一种新的方法来评估发生的微裂纹,即吸收能量的增加速率,这对于检查单晶硅的脆性至延性转变具有重要意义。这种方法为理解微裂纹提供了一种简单的方法,而在传统方法中则非常繁琐。实验研究表明,纳米压痕中吸收能的增大与单晶硅表面的表面裂纹呈现相同的相关性。

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