Thermal design of the Electronic Equipment Enclosures with Natural Air Cooling

摘要

Mathematical models of mass and thermal characteristics of electronic equipment enclosures with natural air cooling are created. Equations to determine an optimal number of printed circuit boards, distance between boards and width of rails are obtained. An algorithm for the optimization of the mass of electronic equipment enclosures with natural air cooling is developed. During the optimization process, the temperature distribution in the enclosure is simulated by CAE system.