首页> 外文会议>7th Mechatronics Forum International Conference 2000 >STICKING EFFECT ON CIRCULAR PLATES IN MICROSTRUCTURES
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STICKING EFFECT ON CIRCULAR PLATES IN MICROSTRUCTURES

机译:在微结构上对圆板的打击作用

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摘要

In wet etching and cleaning processes, a circular plate under surfacernmicromachining may adhere to its underlying substrate, due to the capillary forcernof liquid. This paper studied the sticking effect between a center-anchored circularrnplate and its underlying substrate. Using the balance of the capillary and elasticrnforces, a critical gap is derived to find the gap for adhesion. Using the energyrnmethod, another critical gap is derived to determine the condition for releasing thernplate by the elastic force. The gap, the anchor radius, and the outer radius arernrelated for determining the criterion of adhesion.
机译:在湿法蚀刻和清洁工艺中,由于毛细管力液体,在表面微机械加工下的圆形板可能粘附到其下层基板上。本文研究了中心锚定圆板与其下层基板之间的粘着效应。利用毛细管力和弹性力的平衡,得出临界间隙以找到用于粘附的间隙。使用能量方法,得出另一个临界间隙,以确定通过弹力释放板的条件。间隙,锚定半径和外半径相互关联,以确定粘合标准。

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