首页> 外文会议>The 38th IMAPS Nordic Annual Conference, Sep 23-26, 2001, Oslo, Norway >RF Radio Links and LMDS Communications - Module Technology, Status and Trends
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RF Radio Links and LMDS Communications - Module Technology, Status and Trends

机译:射频无线电链路和LMDS通信-模块技术,现状和趋势

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Broadband Wireless Access (BWA) systems and multi-media services, such as LMDS (Local Multipoint: Distribution System) and MVDS (Microwave Video Distribution System) and related radio links are main activities of the Business Unit "MicroWave Factory" of EADS Deutschland GmbH (EADS: European Aeronautic Defence and Space Company). Based on a long term experience of modem active phased array radars and different, sensor applications up to 100 GHz the communication module market for RF radio links and LMDS communications is still a big challenge for high volume production in our MicroWave Factory. Covering a broad frequency range, our focal points are Point-to-Point radios within 20 38 64 GHz and Point-to-Multipoint radios with spectrum allocations at 26, 28, 31, 32 and 42 GHz. Cost breakdown analysis for different EADS products, like Transmit/Receive (T/R) and RF radio modules give a clear identification of today's cost drivers. The main results and recommendations will be discussed. Advanced substrate technologies, based on PCB multilayers combined with RF layers, e.g. teflon materials, and the use of single packaged RF-MMICs with LGA (Land Grid Array) and MLC (Multi Layer Ceramic) macro modules in BGA (Ball Grid Array) technology will be compared with traditional module architectures based on the use of thin film ceramics and Chip&Wire technologies. The experience of a Micro Wave Unit (MWU) with a MCM-C (Multichip Module, based on ceramics) in LTCC, (Low Temperature Cofired Ceramic) technology will be discussed. Our technology strategy and packaging roadmap is mainly driven by long-term reliability. availability of basic materials and components and modularity. In combination with the idea and challenge of a Box-of-Bricks for a standard mm-wave transceiver radio, future trends of innovative module architectures and packaging technologies will be shown.
机译:EADS Deutschland GmbH的“ MicroWave Factory”业务部门的主要活动是宽带无线接入(BWA)系统和多媒体服务,例如LMDS(本地多点:分发系统)和MVDS(微波视频分发系统)以及相关的无线电链路。 (EADS:欧洲航空防务与航天公司)。基于调制解调器有源相控阵雷达的长期经验以及不同的,高达100 GHz的传感器应用,RF无线电链路和LMDS通信的通信模块市场对于我们MicroWave工厂的大批量生产仍然是一个巨大的挑战。我们的关注点涵盖广泛的频率范围,是20 38 64 GHz范围内的点对点无线电和频谱分配分别为26、28、31、32和42 GHz的点对多点无线电。对不同EADS产品(例如发送/接收(T / R)和RF无线电模块)的成本明细分析可以清楚地识别当今的成本动因。将讨论主要结果和建议。基于PCB多层与RF层相结合的先进基板技术,例如铁氟龙材料,以及将BGA(球栅阵列)技术中使用LGA(地栅阵列)和MLC(多层陶瓷)宏模块的单封装RF-MMIC与基于薄膜使用的传统模块架构进行比较陶瓷和Chip&Wire技术。将讨论LTCC(低温共烧陶瓷)技术中带有MCM-C(基于陶瓷的多芯片模块)的微波单元(MWU)的经验。我们的技术策略和包装路线图主要由长期可靠性驱动。基本材料和组件的可用性以及模块化。结合标准毫米波收发器无线电的概念和挑战,将展示创新模块架构和封装技术的未来趋势。

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