The overmolding material and processes have been developed in order to provide to the electronics market an efficient way to encapsulate electronic modules. The process eliminates multiple housings used in conjunction with standard sealing methods and is replaced with a one step molding process. This innovative process can be used to fully encapsulate a printed board without the degradation of its functionality. The molding cycle time has been optimized through equipment automation and material formulations. The overmolding material properties can be custom tailored which enables the materials to be used in a variety of applications with different combinations of environmental, thermal, and mechanical specifications. The overmolding process is a direct cost reduction in not only the number of parts used for assembly, but also the amount of required equipment, labor, and time needed to manufacture a completely encapsulated module.
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