Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials (Ministry of Education), Shandong University, Jinan 250061, China;
Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials (Ministry of Education), Shandong University, Jinan 250061, China;
Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials (Ministry of Education), Shandong University, Jinan 250061, China;
I-beam and end-plate; welding assembly; temperature field; residual stress; finite element analysis;
机译:工字梁和端板焊接组件温度场和残余应力的有限元分析
机译:2.25Cr-1Mo对焊多道次温度场,组织和残余应力的有限元分析
机译:基弧焊接圈关节残余应力的数值和实验分析和剩余应力场映射到简化有限元模型
机译:I梁和端板焊接组件温度场和残余应力的有限元分析
机译:304L不锈钢环缝焊接的温度和应力场的实验和有限元分析。
机译:实验测量和有限元分析的SA738Gr.B厚板焊接温度分布及残余应力
机译:通过实验测量和有限元分析焊接温度分布和厚焊板中的厚焊板残余应力