Precision Machining of Future Silicon Wafers -Grinding and Slicing Techniques for Flawless Qualities

摘要

Microchip device production depends heavily on high-quality silicon wafers. Current developments in the filed of wafer production focus on substituting the traditional production processes by a surface improving ductile material removal mechanism as well as the implementation of the multi-wire slicing (MWS) process as the industrial standard. Customised machining set-ups as well as fine-tuned process parameters are mandatory for flawless surface qualities of the wafers with subsurface damages (SSD) down to SSD < 2 μm. Most promising results are found with diamond grinding wheels using high grain concentrations and small D-size values.