Three-Dimensional Finite Element Analysis of an Edge-Loaded Thin Film in the Presence of Residual Stress

摘要

Having developed a step-wise methodology for extracting energy release rates from assumed debond shapes, finite element analyses were generated to analyze the mechanisms of failure in thin film systems. The results demonstrate the capability of the finite element method to distinguish individual modes of fracture, ascertain energy release rate sensitivity to residual stress, and quantify the effect progression of debond has on energy release rates. These types of results may be achieved in analytical calculations, but only with great difficulty. Finite element analyses, coupled with fracture mechanics techniques are capable of providing the necessary insight into the mechanisms of failure of thin film systems.