首页> 外文会议>22nd Annual Semiconductor Pure Water and Chemicals Conference Feb 17-19, 2003 Santa Clara, CA >The Anticipated Behavior of Bubbles in Semiconductor Process Liquids
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The Anticipated Behavior of Bubbles in Semiconductor Process Liquids

机译:半导体工艺液体中气泡的预期行为

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Bubbles in semiconductor process liquids can be contaminants. This paper addresses how bubbles are formed in liquids, the size at which they are stable, the rates at which they grow or shrink, and how they might be removed. It shows that equilibrium bubble size is a function of the liquid surface tension, the dissolved gas concentration, and the system pressure. Bubbles that are smaller than the equilibrium size rapidly dissolve while those larger than the equilibrium size rapidly grow. Only under extraordinary conditions will bubbles smaller than 10 μm exist for more than a few seconds. Because bubbles differ significantly from other particulate contaminants, mechanisms used to remove them from liquids must be carefully considered.
机译:半导体工艺液体中的气泡可能是污染物。本文探讨了液体中气泡的形成方式,气泡的稳定尺寸,气泡的生长或收缩速率以及如何去除气泡。它表明平衡气泡的大小是液体表面张力,溶解气体浓度和系统压力的函数。小于平衡大小的气泡会迅速溶解,而大于平衡大小的气泡则会迅速增长。仅在特殊条件下,小于10μm的气泡才会存在几秒钟。由于气泡与其他微粒污染物的区别很大,因此必须仔细考虑将其从液体中去除的机制。

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