A fully contactless wafer-level testing for UHF RFID tag with on-chip antenna

摘要

A fully contactless wafer-level testing for 860-960 MHz RFID tags has been demonstrated. For the first time, an array of 30 RFID ICs with On-Chip-Antenna (OCA) has been simultaneously tested by inductive coupling. The anti-collision algorithm in combination with the insertion of x-y coordinates on the memory bank of each device during the EWS tests has allowed to identify each tag of the wafer. Moreover, a wafer scribe line pre-cutting has permitted to avoid undesired eddy currents generation at wafer level.