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Frequency response technique to recognize turn-to-turn insulation deterioration in transformer winding

机译:频率响应技术可识别变压器绕组中匝间绝缘的恶化

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摘要

One of the most important failure issues in transformers is the turn-to-turn short circuit fault. Turn-to-turn fault can be occurred due to the inter-turn paper insulation deterioration, or due to removing thin layer coated insulation between the winding turns. To date, there is no specific pre-determined method to find (or at least suspect) a deteriorated turn-to-turn insulation medium before catastrophic failure. Frequency Response Analysis (FRA) as a method introduced for transformer mechanical defect recognition, may be able to recognize the turn-to-turn fault potential and assist on this case. Hence, this study has concentrated practically on FRA capability to find turn-to-turn insulation degradation as well as inter-turn aging rate. To this end, two different test objects are used and FRA signatures in various conditions are recorded. FRA results are provided and technically discussed.
机译:变压器最重要的故障问题之一是匝间短路故障。匝间故障可能是由于匝间纸绝缘性能下降,或者是由于去除了缠绕匝之间的薄涂层绝缘层。迄今为止,还没有特定的预定方法来在灾难性故障之前发现(或至少怀疑)变质的匝间绝缘介质。作为用于变压器机械缺陷识别的一种方法,频率响应分析(FRA)可能能够识别匝间故障电位并在这种情况下提供帮助。因此,这项研究实际上集中在FRA发现匝间绝缘退化以及匝间老化率的能力上。为此,使用了两个不同的测试对象,并记录了各种条件下的FRA签名。提供了FRA结果并进行了技术讨论。

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