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Soft-error resilient 3D Network-on-Chip router

机译:具有软错误恢复能力的3D片上网络路由器

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摘要

Three-Dimensional Networks-on-Chips (3D-NoCs) have been proposed as an auspicious solution, merging the high parallelism of the Network-on-Chip (NoC) paradigm with the high-performance and low-power of 3D-ICs. However, as feature sizes and power supply voltages continually decrease, the devices and interconnects have become more vulnerable to transient errors. Transient errors, or soft errors, have severe consequences on chip performance, such as deadlock, data corruption, packet loss and increased packet latency. In this paper, we propose a soft-error resilient 3D-NoC router (SER-3DR) architecture for highly-reliable many-core Systems-on-Chips. The proposed architecture is able to recover from transient errors occurring in different pipeline stages of the SER-3DR.We implemented the architecture in hardware with 45 nm CMOS technology. Evaluation results show that SER-3DR is able to achieve a high level of transient error protection with a latency increase of 18.16%, an additional area cost of 14.98% and a power overhead of 5.90% when compared to the baseline router architecture.
机译:已经提出了一种二维片上网络(3D-NoC)作为一种吉祥的解决方案,它将片上网络(NoC)范例的高并行性与3D-IC的高性能和低功耗相结合。但是,随着特征尺寸和电源电压的不断降低,设备和互连变得更容易受到瞬态误差的影响。瞬时错误或软错误会对芯片性能产生严重影响,例如死锁,数据损坏,数据包丢失和增加的数据包延迟。在本文中,我们为高度可靠的多核片上系统提出了一种软错误弹性3D-NoC路由器(SER-3DR)架构。所提出的架构能够从SER-3DR的不同流水线阶段中发生的瞬态错误中恢复过来。评估结果表明,与基线路由器体系结构相比,SER-3DR可以实现高水平的瞬态错误保护,其延迟增加了18.16%,额外的区域成本为14.98%,功耗为5.90%。

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