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Analysis and comparison of high power semiconductor device losses in 5MW PMSG MV wind turbines

机译:5MW PMSG MV风力发电机大功率半导体器件损耗的分析与比较

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This paper provides a comparison of high power semiconductor devices in 5MW-class Permanent Magnet Synchronous Generator (PMSG) Medium Voltage (MV) wind turbines. High power semiconductor devices of press-pack type IGCT, module type IGBT, press-pack type IEGT, and press-pack type IGBT of both 4.5kV and 6.5kV are considered in this paper. Benchmarking is performed based on neutral point clamped 3-level back-to-back type voltage source converter supplied from grid voltage of 4160V. The feasible number of semiconductor devices in parallel is designed through the loss analysis considering both conduction and switching losses under the given operating conditions of 5MW-class PMSG wind turbines, particularly for the application in offshore wind farms. The loss analysis is confirmed through PLECS simulations. The comparison result shows that press-pack IGCT type semiconductor device has the highest efficiency.
机译:本文对5MW级永磁同步发电机(PMSG)中压(MV)风力涡轮机中的高功率半导体器件进行了比较。本文考虑了4.5kV和6.5kV压装式IGCT,模块式IGBT,压装式IEGT和压装式IGBT的大功率半导体器件。基准测试是基于由4160V电网电压提供的中性点钳位3电平背对背型电压源转换器进行的。通过在5MW级PMSG风力发电机的给定运行条件下同时考虑传导损耗和开关损耗的损耗分析,设计出并联的半导体器件的可行数量,特别是在海上风电场中。损耗分析通过PLECS仿真得到证实。比较结果表明,压装IGCT型半导体器件具有最高效率。

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