Silicon substrate with deep trench for white light LED packaging

摘要

This study proposes an encapsulation shaping method for white light LED packaging, using a silicon substrate with an island structure and using a simple silicate phosphor dispensing process. The technology utilizes the interaction of the interfacial tension between silicon island structure and silicone phosphor material for encapsulation shaping at an appropriate curing temperature. Two kinds of encapsulation structures, hemispherical and shell-type lens, are fabricated using different encapsulation doses, which allows specific optical requirements to be fulfilled. The experimental results show that a hemispherical encapsulation lens with a radius of curvature of 0.9 mm is formed, when the diameter of the island structure is 1.8 mm and the dispensing dose is 1.5 mL. When the dispensing doses are 4.0 mL, shell-type lens structure with cylinder is fabricated. In terms of optical characteristics of the two kinds of lens structure, there is a large measured variation in chromaticity at different view angles, it is suitable for different applications.